TI (Texas Instruments) AR629U9/883 Mfr Package Description: CERAMIC, PGA-180 Technology: CMOS Package Shape: SQUARE Package Style: GRID ARRAY Terminal Form: PIN/PEG Terminal Pitch: 2.54 mm Terminal Position: PERPENDICULAR Number of Functions: 1 Number of Terminals: 180 Package Body Material: CERAMIC, METAL-SEALED COFIRED Temperature Grade: MILITARY Operating Temperature-Max: 125 Cel Operating Temperature-Min: -55 Cel Supply Voltage-Max (Vsup): 5.25 V Supply Voltage-Min (Vsup): 4.75 V Supply Voltage-Nom (Vsup): 5 V Data Encoding/Decoding Method: BIPH-LEVEL(MANCHESTER) Data Transfer Rate-Max: 2M Microprocess IC Type: SERIAL COMM CONTROLLER Number of I/O Lines: 1